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| DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUITS mPC2745TB, mPC2746TB 3 V, SUPER MINIMOLD SILICON MMIC WIDEBAND AMPLIFIER FOR MOBILE COMMUNICATIONS DESCRIPTION The mPC2745TB and mPC2746TB are silicon monolithic integrated circuits designed as buffer amplifier for mobile communications. These ICs are packaged in super minimold package which is smaller than conventional minimold. The mPC2745TB and mPC2746TB have each compatible pin connections and performance to mPC2745T/ mPC2746T of conventional minimold version. So, in the case of reducing your system size, mPC2745TB/mPC2746TB are suitable to replace from mPC2745T/mPC2746T. These ICs are manufactured using NEC's 20 GHz fT NESATaIII silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion/migration. Thus, these IC have excellent performance, uniformity and reliability. FEATURES * High-density surface mounting : 6 pin super minimold package * Supply voltage * Wideband response * High isolation : Recommended VCC = 2.7 to 3.3 V Circuit operation VCC = 1.8 to 3.3 V : fu = 2.7 GHzTYP. @mPC2745TB fu = 1.5 GHzTYP. @mPC2746TB : ISL = 38 dBTYP. @mPC2745TB ISL = 45 dBTYP. @mPC2746TB APPLICATION * 1.5 GHz to 2.5 GHz communication system (PHS, wireless LAN; etc.): mPC2745TB * 800 MHz to 900 MHz cellular telephone (CT2, GSM, etc.) : mPC2746TB ORDERING INFORMATION PART NUMBER PACKAGE 6 pin super minimold MARKING C1Q C1R SUPPLYING FORM Embossed tape 8 mm wide. 1, 2, 3 pins face to perforation side of the tape. Qty 3 kp/reel. fU 2.7 GHzTYP. 1.5 GHzTYP. mPC2745TB-E3 mPC2746TB-E3 Remarks To order evaluation samples, please contact your local NEC sales office. (Part number: mPC2745TB, mPC2746TB) Caution: Electro-static sensitive devices Document No. P11511EJ2V0DS00 (2nd edition) Date Published April 1997 N (c) 1996 mPC2745TB, mPC2746TB PIN CONNECTIONS (Top View) (Bottom View) 4 4 3 Pin NO. 1 2 Pin name INPUT GND GND OUTPUT GND 3 2 C1Q 5 5 2 3 4 1 6 6 1 5 6 VCC Marking is an example of PC2745TB PRODUCT LINE-UP OF mPC2745, mPC2746 (TA = +25 C, VCC = 3.0 V, ZL = Zs = 50 W) PART NO. fu (GHz) 2.7 PO(sat) (dBm) GP (dB) 12 NF (dB) 6.0 ICC (mA) 7.5 6 pin super minimold 6 pin minimold 1.5 0 19 4.0 7.5 6 pin super minimold C1R PACKAGE 6 pin minimold C1Q MARKING mPC2745T mPC2745TB mPC2746T mPC2746TB -1 Remarks Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. Notice The package size distinguish between minimold and super minimold. SYSTEM APPLICATION EXAMPLE Digital Cellular System Block Diagram Digital Cellular System Block Diagram RX DEMO I Q PLL SW PLL I 0 TX PA 90 Q : PC2745TB, PC2746TB applicable To know the associated products, please refer to each latest data sheet. 2 mPC2745TB, mPC2746TB PIN EXPLANATION Applied voltage V Pin voltage Note V 0.87 Pin NO. 1 Pin Name Function and applications Internal equivalent circuit INPUT 3/4 0.82 4 OUTPUT Signal input pin. A internal matching circuit, configured with resistors, enables 50 W connection over a wide band. this pin must be coupled to signal source with capacitor for DC cut. Signal output pin. A internal matching circuit, configured with resistors, enables 50 W connection over a wide band. This pin must be coupled to next stage with capacitor for DC cut. Power supply pin. This pin should be externally equipped with bypass capacity to minimize ground impedance. Ground pin. This pin should be connected to system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. All the ground pins must be connected together with wide ground pattern to decrease impedance difference. 6 3/4 1.95 2.54 4 1 6 VCC 2.7 to 3.3 3/4 2 3 5 GND 0 3/4 2 3 5 Note Pin voltage is measured at VCC = 3.0 V. Above: mPC2745TB, Below: mPC2746TB 3 mPC2745TB, mPC2746TB ABSOLUTE MAXIMUM RATINGS PARAMETER Supply voltage Circuit current Input power level Total power dissipation SYMBOL VCC ICC Pin PD TA = +25 C TA = +25 C TA = +25 C Mounted on double sided copper clad 50 50 1.6 mm epoxy glass PWB (TA = +85 C) CONDITION RATINGS 4.0 16 0 200 UNIT V mA dBm mW Operating ambient temperature Storage temperature TA TSTG -40 to +85 -55 to +150 C C RECOMMENDED OPERATING CONDITIONS PARAMETER Supply voltage Operating ambient temperature SYMBOL VCC TA MIN. 2.7 TYP. 3.0 +25 MAX. 3.3 +85 UNIT V NOTICE -40 C ELECTRICAL CHARACTERISTICS (TA = + 25 C, VCC = 3.0 V, ZL = ZS = 50 W) PARAMETER Circuit current Power Gain Noise figure Upper limit operating frequency SYMBOL ICC GP NF fu TEST CONDITION MIN. No signals f = 0.5 GHz f = 0.5 GHz 3 dB down below from gain at f = 100 MHz f = 0.5 GHz f = 0.5 GHz f = 0.5 GHz f = 0.5 GHz, Pin = -6 dBm 5.0 9.0 mPC2745TB TYP. 7.5 12 6 2.7 MAX. 10.0 14 7.5 MIN. 5.0 16 mPC2746TB TYP. 7.5 19 4.0 1.5 MAX. 10.0 21 5.5 UNIT mA dB dB GHz 3/4 2.3 3/4 1.1 3/4 3/4 Isolation Input return loss Output return loss Maximum output level ISL RLin RLout PO(sat) 33 8 2.5 38 11 5.5 3/4 3/4 3/4 3/4 40 10 5.5 45 13 8.5 0 3/4 3/4 3/4 3/4 dB dB dB dBm -4 -1 -3 4 mPC2745TB, mPC2746TB STANDARD CHARACTERISTICS FOR REFERENCE (TA = +25 C, VCC = 3.0 V, ZL = ZS = 50 W) PARAMETER Circuit current Power Gain SYMBOL ICC GP TEST CONDITION VCC = 1.8 V, No signals VCC = 3.0 V, f = 1 GHz VCC = 3.0 V, f = 2 GHz VCC = 1.8 V, f = 500 MHz VCC = 3.0 V, f = 1 GHz VCC = 3.0 V, f = 2 GHz VCC = 1.8 V, f = 500 MHz VCC = 1.8 V, 3 dB down below from gain at f = 100 MHz mPC2745TB mPC2745B 4.5 12 11 7 5.5 5.7 8.0 1.8 4.5 18.5 UNIT mA dB 3/4 14 4.2 dB Noise figure NF 3/4 5.0 1.1 GHz Upper limit operating frequency Isolation fu ISL VCC = 3.0 V, f = 1 GHz VCC = 3.0 V, f = 2 GHz VCC = 1.8 V, f = 500 MHz VCC = 3.0 V, f = 1 GHz VCC = 3.0 V, f = 2 GHz VCC = 1.8 V, f = 500 MHz VCC = 3.0 V, f = 1 GHz VCC = 3.0 V, f = 2 GHz VCC = 1.8 V, f = 500 MHz VCC = 3.0 V, f = 1 GHz, Pin = -6 dBm VCC = 3.0 V, f = 2 GHz, Pin = -6 dBm VCC = 1.8 V, f = 500 MHz, Pin = -10 dBm VCC = 3.0 V, Pout = -20 dBm, f1 = 500 MHz, f2 = 502 MHz VCC = 3.0 V, Pout = -20 dBm, f1 = 1 000 MHz, f2 = 1 002 MHz VCC = 1.8 V, Pout = -20 dBm, f1 = 500 MHz, f2 = 502 MHz 33 30 35 13 14 6.5 6.5 8.5 6.0 38 dB 3/4 37 10 dB Input return loss RLin 3/4 10 8.5 dB Output return loss RLout 3/4 9.5 Maximum output level PO(sat) -2.5 -3.5 -11 -54 -50 -31 -1 3/4 -8 -51 3/4 -37 dBm 3rd order intermodulation distortion IM3 dBc 5 mPC2745TB, mPC2746TB TEST CIRCUIT VCC 1 000 pF C3 6 50 IN 1 000 pF C1 1 4 C2 1 000 pF 50 OUT 2, 3, 5 EXAMPLE OF APPLICATION CIRCUIT VCC 1 000 pF C3 6 50 IN 1 000 pF C1 1 4 C4 1 000 pF C5 1 000 pF R1 50 to 200 2, 3, 5 To stabilize operation, please connect R1, C5 The application circuits and their parameters are for references only and are not intended for use in actual designin's. 1 000 pF C6 6 1 4 C2 1 000 pF 50 OUT 2, 3, 5 Capacitors for VCC, input and output pins 1 000 pF capacitors are recommendable as bypass capacitor for VCC pin and coupling capacitors for input/output pins. Bypass capacitor for VCC pin is intended to minimize VCC pin's ground impedance. Therefore, stable bias can be supplied against VCC fluctuation. Coupling capacitors for input/output pins are intended to minimize RF serial impedance and cut DC. To get flat gain from 100 MHz up, 1 000 pF capacitors are assembled on the test circuit. [Actually, 1 000 pF capacitors give flat gain at least 10 MHz. In the case of under 10 MHz operation, increase the value of coupling capacitor such as 2 200 pF. Because the coupling capacitors are determined by the equation of C = 1/(2 p fZs).] 6 mPC2745TB, mPC2746TB Illustration of the test circuit assembled on evaluation board AMP-2 Top View 1 23 IN OUT C C C 1Q 6 54 Mounting direction (Marking is an example for PC2745TB) VCC C Component List Value C 1 000 pF Notes 1. 30 x 30 x 0.4 mm double sided copper clad polyimide board. 2. Back side: GND pattern 3. Solder plated on pattern 4. : Through holes 7 mPC2745TB, mPC2746TB TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = +25 C) 3/4 mPC2745TB 3/4 CIRCUIT CURRENT vs. SUPPLY VOLTAGE 10 10 CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE 8 Circuit Current ICC (mA) Circuit Current ICC (mA) 8 VCC = 3.0 V 6 VCC = 1.8 V 4 6 4 2 2 0 1 2 3 4 0 -40 -20 0 20 40 60 80 100 Supply Voltage VCC (V) Operating Ambient Temperature TA (C) NOISE FIGURE, POWER GAIN vs. FREQUENCY 15 VCC = 3.3 V VCC = 3.0 V 15 POWER GAIN vs. FREQUENCY TA = -40 C 10 Power Gain GP (dB) Noise Figure NF (dB) VCC = 2.7 V GP 5 Power Gain GP (dB) VCC = 1.8 V TA = +85 C 10 TA = +25 C 10 9 8 7 6 0 NF VCC = 1.8 V -5 VCC = 2.7 V VCC = 3.0 V VCC = 3.3 V VCC = 3.0 V 1.0 3.0 5 0.1 0.3 1.0 3.0 5 -10 0.1 0.3 Frequency f (GHz) Frequency f (GHz) ISOLATION vs. FREQUENCY -10 0 INPUT RETURN LOSS, OUTPUT RETURN LOSS vs. FREQUENCY RLout VCC = 1.8 V VCC = 1.8 V VCC = 3.0 V Input Return Loss RLin (dB) Output Return Loss RLout (dB) -20 VCC = 1.8 V Isolation ISL (dB) -10 RLin -30 -20 VCC = 3.0 V -40 VCC = 3.0 V -50 -30 -60 0.1 0.3 1.0 3.0 -40 0.1 0.3 1.0 3.0 Frequency f (GHz) Frequency f (GHz) 8 mPC2745TB, mPC2746TB 3/4 mPC2745TB 3/4 OUTPUT POWER vs. INPUT POWER 10 f = 500 MHz Output Power PO (dBm) OUTPUT POWER vs. INPUT POWER 10 f = 500 MHz VCC = 3.0 V Output Power PO (dBm) VCC = 3.0 V VCC = 3.3 V 0 TA = +85 C 0 TA = +25 C -10 TA = -40 C -20 TA = +85 C -30 TA = -40 C TA = +25 C -10 VCC = 2.7 V -20 VCC = 1.8 V -30 -40 -50 -40 -30 -20 -10 0 -40 -50 -40 -30 -20 -10 0 Input Power Pin (dBm) Input Power Pin (dBm) OUTPUT POWER vs. INPUT POWER 10 f = 1.0 GHz 0 Output POwer PO (dBm) OUTPUT POWER vs. INPUT POWER 10 VCC = 3.3 V VCC = 3.0 V Output Power PO (dBm) f = 2.0 GHz 0 VCC = 3.3 V -10 VCC = 3.0 V -10 VCC = 2.7 V VCC = 2.7 V -20 VCC = 1.8 V -30 -20 VCC = 1.8 V -30 -40 -50 -40 -30 -20 -10 0 -40 -50 -40 -30 -20 -10 0 Input Power Pin (dBm) Input Power Pin (dBm) SATURATED OUTPUT POWER vs. FREQUENCY 3rd Order Intermodulation Distortion IM3 (dBc) 3RD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE 60 f1 = 500 MHz f2 = 502 MHz 50 VCC = 3.3 V 40 VCC = 2.7 V VCC = 1.8 V 30 VCC = 3.0 V 5 Saturated Output Power PO(sat) (dBm) Pin = -6 dBm VCC = 3.0 V 0 VCC = 3.3 V -5 VCC = 2.7 V -10 VCC = 1.8 V 20 -15 0.1 0.3 1.0 3.0 10 -30 -25 -20 -15 -10 -5 Frequency f (GHz) Output Power of Each Tone PO(each) (dBm) 9 0.1 0.2 0.1 5 0.4 5 0.0 0.3 WAVELENGT HS TO 0 0.01 0.49 0.02 WARD 0.48 0 0.49 0.01 0.0 GENE 0.48 7 3 0.02 RA 0.4 LECTION COEFFICIENT IN DE OF REF 3. GREES 0.47 0.0 TOR 6 0.0 ANGLE 0.4 4 0.4 4 -160 0 6 0.0 0.0 0.4 5 15 0 0 5 -15 5 0.4 5 0.0 0.3 WAVELENGT HS TO 0 0.01 0.49 0.02 WARD 0.48 0 0.49 0.01 0.0 GENE 0.48 7 3 0.02 RA 0.4 LECTION COEFFICIENT IN DE OF REF 3. GREES 0.47 0.0 TOR 6 0.0 ANGLE 0.4 4 0.4 4 -160 0 6 0.0 0.0 0.4 5 15 0 0 5 -15 44 0. 06 0. 40 -1 0.3 P ON -1 4 EN T 0 40 0.1 POS ITIV ER P ON 0.2 14 0. 0. 06 44 44 0. 06 0. EN T 0.1 0.2 0. 07 0. 43 0. 0. 4 0. 0. 43 07 0. 0. 43 07 30 30 -1 8 0.0 2 0.4 8 0.0 2 0.4 0.4 0.0 2 8 NE GA 0.4 0.0 2 8 0 0 0.3 12 0 -12 9 0.0 1 0.4 NE GA 0.5 M CO CE AN CT EA -JX E R Zo TIV 0. 4 EA C T AN +JX CE C Zo OM PO -1 0 13 1 -12 0.4 .09 0 0.4 110 0.4 1 0.0 9 -110 0.40 0.10 0.40 0.10 -110 0.39 0.11 0.39 0.11 -100 0.9 0.8 -100 0.38 0.12 -90 0.2 0.2 RESISTANCE COMPONENT R 0.2 Zo -90 RESISTANCE COMPONENT R 0.2 Zo 1.0 1.0 90 1.0 0.38 0.12 0.2 0.2 0.4 0.4 0.4 0.4 0.37 0.13 0.13 0.37 0.37 0.13 0.4 0.13 0.37 0.6 0.6 2.0 G 0.6 1.2 0.6 1.2 0.6 0.4 0.6 8 0.6 2.0 G 0. 0. 0. 0.8 0. 0.8 0.8 1.2 8 80 1.4 1.2 1.2 1.0 1. 0 -80 0.14 0.36 1.4 8 8 -80 1.0 0.36 0.14 0.1 G 1.4 70 0.15 0.35 1.8 2.0 1.4 1.4 -70 0.36 0.14 -70 0.35 0.15 0.35 0.15 4 0.3 6 0.1 4 0.3 6 0.1 -60 1.0 G 3 0.3 7 0.1 0 0 5.0 50 0. 0. 18 32 3 0.3 7 0.1 2.0 4.0 0.1 0.3 7 3 2.0 2.0 -5 -60 -5 0 32 0. 18 0. 0.1 G 32 0. 18 0. 0 3. 3. 4.0 4.0 5.0 5.0 10 20 10 20 50 50 mPC2745TB, mPC2746TB 0 0.2 0 0.3 1 0.2 9 0.2 2 0.2 8 0.2 20 0.23 0.27 10 0.24 0.26 0.25 0.25 0 0.26 0.24 -10 0.27 0.23 -20 0.2 8 0.2 2 0.2 0.2 9 1 0.3 0.2 0 0 0 0.2 0 0.3 50 10 20 50 50 30 -30 1 0.2 9 0.2 30 20 5.0 20 10 20 19 0. 31 0. 40 -4 0 0. 0. 31 19 19 0. 31 0. 40 2 0.2 8 0.2 20 0.23 0.27 10 0.24 0.26 0.25 0.25 0 0.26 0.24 -10 0.27 0.23 -20 0.2 8 0.2 2 -30 0.2 0.2 9 1 0.3 0.2 0 0 -4 0 0. 0. 31 19 10 3/4 mPC2745TB 3/4 S22-FREQUENCY S11-FREQUENCY 0.1 0.1 S Parameter (VCC = 3.0 V) 0.2 0.2 POS ITIV ER 0. 0. 06 44 0.3 07 0. 43 0. 0. 4 1 0.2 NE 30 0.5 0.5 M CO CE AN CT EA -JX E R Zo TIV 0.3 0.4 0.5 0.6 14 0 EA C T AN +JX C E C Zo OM PO NE 0 .5 NT NT 12 0 9 0.0 1 0.4 0.6 0.6 0.10 0.40 0.6 0.6 0.10 0.40 110 0.7 0.5 0.7 0.8 0.11 0.39 0.7 0.7 0.8 0.6 0.8 0.8 0.11 0.39 0.7 100 0.7 0.8 0.9 1.0 0.2 100 0.9 0.12 0.38 0.9 0.9 0.12 0.38 0.9 1.0 0.4 1.0 90 0.2 0.4 0.6 1.2 0.8 80 0.14 0.36 1. 0 1.6 1.0 1. 0 1.6 0 1. 1.0 1.8 2.0 1.4 0.15 0.35 70 0.5 G 1.0 G 1.6 0.1 6 0.3 4 1.6 1.6 1.6 3.0 4.0 5.0 2.0 50 0.1 6 0.3 4 1.8 60 3.0 1.8 1.8 1.8 60 0.1 0.3 7 3 0.5 G 3. 0 0. 0. 18 32 3. 0 10 4.0 10 4.0 5.0 50 mPC2745TB, mPC2746TB Typical S Parameter Values (TA = +25 C) mPC2745TB VCC = 3.0 V, ICC = 8.4 mA FREQUENCY MHz 100.0000 200.0000 300.0000 400.0000 500.0000 600.0000 700.0000 800.0000 900.0000 1000.0000 1100.0000 1200.0000 1300.0000 1400.0000 1500.0000 1600.0000 1700.0000 1800.0000 1900.0000 2000.0000 2100.0000 2200.0000 2300.0000 2400.0000 2500.0000 2600.0000 2700.0000 2800.0000 2900.0000 3000.0000 MAG .318 .325 .346 .341 .339 .326 .311 .312 .325 .356 .382 .416 .416 .415 .393 .386 .373 .369 .366 .353 .344 .313 .293 .267 .262 .253 .253 .248 .237 .230 S11 ANG MAG 4.055 4.030 3.985 3.916 3.842 3.775 3.668 3.594 3.525 3.497 3.503 3.542 3.569 3.520 3.501 3.429 3.355 3.303 3.229 3.179 3.081 2.999 2.911 2.802 2.695 2.598 2.496 2.400 2.306 2.209 S21 ANG S12 MAG .003 .006 .009 .012 .013 .015 .017 .018 .020 .019 .020 .022 .023 .025 .025 .025 .026 .028 .028 .030 .031 .031 .033 .034 .036 .036 .034 .036 .032 .031 ANG 62.9 54.2 42.0 29.4 11.8 1.6 S22 MAG .593 .584 .579 .562 .546 .527 .515 .511 .512 .523 .525 .530 .518 .509 .492 .481 .474 .468 .457 .440 .416 .389 .365 .346 .331 .321 .311 .299 .279 .254 ANG K -3.9 -5.9 -7.2 -8.9 -10.8 -13.9 -20.8 -25.8 -31.9 -32.8 -32.7 -31.2 -30.9 -30.8 -30.3 -31.3 -30.5 -31.6 -29.6 -30.0 -28.6 -29.5 -31.6 -35.1 -39.9 -40.3 -40.9 -35.5 -30.2 -20.6 -17.2 -35.5 -52.5 -70.7 -87.3 -104.7 -121.5 -138.1 -154.2 -170.3 173.7 156.7 139.1 121.4 103.7 86.8 69.7 52.7 35.8 18.8 1.5 -15.4 -32.5 -49.4 -66.0 -82.3 -98.6 -114.6 -130.2 -146.4 -11.9 -24.2 -38.4 -45.9 -54.3 -70.5 -78.4 -88.4 -102.9 -114.1 -125.7 -130.3 -142.5 -152.4 -164.9 -177.1 171.1 160.8 148.3 134.8 121.4 106.5 92.8 83.6 -6.6 -12.1 -16.5 -20.6 -23.0 -26.2 -29.9 -32.4 -34.8 -35.8 -36.3 -36.8 -37.5 -38.8 -40.5 -42.5 -43.8 -44.8 -44.8 -45.0 -45.0 -45.4 -46.4 -47.4 -48.2 -48.3 -47.6 -46.7 -46.3 -46.2 20.94 11.68 8.29 6.26 6.29 5.50 5.46 5.36 4.91 4.93 4.56 4.14 3.92 3.53 3.68 3.78 3.68 3.50 3.63 3.62 3.85 4.23 4.23 4.40 4.45 4.54 5.08 5.01 5.88 6.49 11 mPC2745TB, mPC2746TB TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = +25 C) 3/4 mPC2746TB 3/4 CIRCUIT CURRENT vs. SUPPLY VOLTAGE 10 10 CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE 8 Circuit Current ICC (mA) Circuit Current ICC (mA) 8 VCC = 3.0 V 6 1.8 V 4 6 4 2 2 0 1 2 3 4 0 -60 -40 -20 0 20 40 60 80 100 Supply Voltage VCC (V) Operating Ambient Temprature TA (C) NOISE FIGURE, POWER GAIN vs. FREQUENCY 22 20 18 Power Gain GP (dB) POWER GAIN vs. FREQUENCY 22 VCC = 3.3 V 3.0 V Power Gain GP (dB) 21 20 19 18 17 16 15 14 13 +85 C TA = -40 C +25 C 16 14 GP 2.7 V 1.8 V Noise Figure NF (dB) 7 12 10 8 6 NF VCC = 1.8 V 5 3 4 0.1 0.3 2.7 V-3.3 V 1.0 3.0 12 0.1 VCC = 3.0 V 0.3 1.0 3.0 Frequency f (GHz) Frequency f (GHz) ISOLATION vs. FREQUENCY 10 10 INPUT RETURN LOSS, OUTPUT RETURN LOSS vs. FREQUENCY VCC = 3.0 V 0 Input Return Loss RLin (dB) Output Return Loss RLout (dB) 0 VCC = 1.8 V RLout -10 RLin 3.0 V Isolation ISL (dB) -20 1.8 V -40 VCC = 3.0 V -20 3.0 V 1.8 V -60 -80 0.1 0.3 1.0 3.0 -30 0.1 0.3 1.0 3.0 Frequency f (GHz) Frequency f (GHz) 12 mPC2745TB, mPC2746TB 3/4 mPC2746TB 3/4 OUTPUT POWER vs. INPUT POWER 10 f = 500 MHz Output Power PO (dBm) 0 2.7 V -10 1.8 V -20 3.0 V VCC = 3.3 V Output Power PO (dBm) 0 2.7 V -10 1.8 V -20 10 f = 1.0 GHz VCC = 3.3 V 3.0 V OUTPUT POWER vs. INPUT POWER -30 -30 -40 -50 -40 -30 -20 -10 0 -40 -50 -40 -30 -20 -10 0 Input Power Pin (dBm) Input Power Pin (dBm) OUTPUT POWER vs. INPUT POWER 10 f = 500 MHz VCC = 3.0 V Output Power PO (dBm) 0 +25 C -40 C -10 -40 C -20 +85 C +25 C TA = +85 C 0 10 OUTPUT POWER vs. INPUT POWER TA = +85 C f = 1.0 GHz VCC = 3.0 V Output Power PO (dBm) +25 C -10 -40 C +85 C -20 -40 C +25 C -30 -30 -40 -50 -40 -30 -20 -10 0 -40 -50 -40 -30 -20 -10 0 Input Power Pin (dBm) Input Power Pin (dBm) SATURATED OUTPUT POWER vs. FREQUENCY 10 Saturated Output Power PO(sat) (dBm) VCC = 2.7 to 3.3 V Pin = -6 dBm VCC = 3.3 V 3.0 V 0 2.7 V -5 1.8 V -10 VCC = 1.8 V Pin = -10 dBm -15 0.1 0.3 1.0 3.0 3rd Order Intermodulation Distortion IM3 (dBc) 3RD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE 60 f1 = 500 MHz VCC = 3.3 V f2 = 502 MHz 5 50 40 3.0 V 2.7 V 30 1.8 V 20 10 -30 -25 -20 -15 -10 -5 0 Frequency f (GHz) Output Power of Each Tone PO(each) (dBm) 13 0.1 5 0.4 5 0.0 0.2 5 0.4 5 0.0 0.3 WAVELENGT HS TO 0 0.01 0.49 0.02 WARD 0.48 0 0.49 G 0.01 0.0 ENE 0.48 7 3 0.02 RA 0.4 LECTION COEFFICIENT IN DE T OF REF 3. GREES 0.47 0.0 OR 6 0.0 ANGLE 0.4 4 0.4 4 -160 0 6 .0 0.0 0 0.4 5 15 0 0 5 -15 0.1 0.3 0.1 44 0. 06 0. 40 -1 0.3 PO RE 0. 4 07 0. 43 0. T N EN 0 -1 40 POS ITIV E P ON 0.2 E NT 14 0. 0. 06 44 44 0. 06 0. 0.1 0.2 4 0. 0. 0. 43 07 0. 4 0. 0. 43 07 30 30 -1 8 0.0 2 0.4 0.4 0.0 2 8 8 0.0 2 0.4 NE GA 0.4 0.0 2 8 0 0 0.3 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0.2 NE GA 0.5 T 0.5 12 0 -12 OM EC NC TA AC JX RE - o IVE Z 0.2 -1 0 13 -12 0.4 1 0.0 9 110 110 -110 0.40 0.10 0.40 0.10 -110 0.10 0.40 0.10 0.40 0.7 0.5 0.7 0.8 0.39 0.11 0.11 0.39 0.4 1 0.0 9 0.39 0.11 -100 -100 0.38 0.12 -90 0.2 RESISTANCE COMPONENT R 0.2 Zo -90 RESISTANCE COMPONENT R 0.2 Zo 1.0 1.0 90 1.0 0.38 0.12 0.2 0.4 0.2 0.4 0.4 0.4 0.37 0.13 0.37 0.13 0.13 0.37 0.4 0.13 0.37 0.6 0.5 G 1.5 G 0.6 0.6 0.6 1.2 8 0.6 1.2 0.6 0.4 0. 0. 0. 0.8 0.8 0. 0.8 1.2 8 1.4 1.2 1.2 1.0 80 1.4 8 8 -80 -80 1.0 0.36 0.14 1.4 1.4 70 0.15 0.35 1.8 2.0 1.4 -70 0.36 0.14 -70 0.35 0.15 0.35 0.15 4 0.3 6 0.1 4 0.3 6 0.1 -60 0.5 G 3 0.3 7 0.1 0 0 5.0 50 0. 0. 18 32 3 0.3 7 0.1 2.0 4.0 0.1 0.3 7 3 -5 2.0 2.0 -60 -5 0 32 0. 18 0. 32 0. 18 0. 0 3. 3. 4.0 4.0 5.0 5.0 10 20 10 20 50 50 mPC2745TB, mPC2746TB 0 0.2 0 0.3 1 0.2 9 0.2 2 0.2 8 0.2 20 0.23 0.27 10 0.24 0.26 0.25 0.25 0 0.26 0.24 -10 0.27 0.23 -20 0.2 8 0.2 2 0.2 0.2 9 1 0.3 0.2 0 0 0 0.2 0 0.3 50 10 20 50 50 30 -30 1 0.2 9 0.2 30 20 5.0 20 10 20 19 0. 31 0. 40 -4 0 0. 0. 31 19 19 0. 31 0. 40 2 0.2 8 0.2 20 0.23 0.27 10 0.24 0.26 0.25 0.25 0 0.26 0.24 -10 0.27 0.23 -20 0.2 8 0.2 2 -30 0.2 0.2 9 1 0.3 0.2 0 0 -4 0 0. 0. 31 19 14 3/4 mPC2746TB 3/4 S11-FREQUENCY 0.1 0.1 0.2 0.2 S22-FREQUENCY S Parameter (VCC = 3.0 V) 6 0.4 4 0.0 0. 0. 06 44 7 0.4 3. 0.0 -15 0 WAVELENGT HS TO 0 0.01 0.49 0.02 WARD 0.48 0 0.49 G 0.01 0.0 ENE 0.48 3 0.02 RA T 0.4 REFLECTION COEFFICIENT IN DEGR OF 7 0.0 OR EES ANGLE 0.4 4 -160 0 6 0.0 0.4 5 15 0 5 0.3 POS ITIV ER 07 0. 43 0. 0. 4 1 30 AC T AN +JX CE C Zo OM PO 0.5 T OM EC NC TA AC JX RE - o IVE Z 14 0 EA C T AN +JX CE C Zo OM PO NE NE 0 .5 NT NT 12 0 9 0.0 1 0.4 9 0.0 1 0.4 0.6 0.4 0.7 0.6 0.6 0.6 0.7 0.8 0.8 0.9 0.6 0.7 100 0.8 100 0.11 0.39 0.1 G 0.9 0.8 0.9 0.12 0.38 0.9 0.12 0.38 0.9 1.0 0.4 1.0 0.2 90 0.2 0.4 0.6 0.6 1.2 0.8 80 0.14 0.36 1. 0.14 0.36 0 1.6 1.0 1. 0 1. 0 1.6 1.8 2.0 0 1. 1.0 1.4 70 0.15 0.35 1.0 G 1.5 G 1.0 G 1.6 1.6 1.8 0.1 6 0.3 4 0.1 G 1.6 3.0 1.8 60 1.6 3.0 4.0 5.0 2.0 50 0.1 6 0.3 4 1.8 1.8 60 0. 0. 18 32 0.1 0.3 7 3 3. 0 3. 0 10 4.0 10 4.0 5.0 50 mPC2745TB, mPC2746TB Typical S Parameter Values (TA = +25 C) mPC2746TB VCC = 3.0 V, ICC = 7.7 mA FREQUENCY MHz 100.0000 200.0000 300.0000 400.0000 500.0000 600.0000 700.0000 800.0000 900.0000 1000.0000 1100.0000 1200.0000 1300.0000 1400.0000 1500.0000 1600.0000 1700.0000 1800.0000 1900.0000 2000.0000 MAG .146 .130 .117 .128 .139 .145 .135 .131 .119 .142 .170 .219 .245 .268 .270 .268 .258 .251 .249 .240 S11 ANG 165.0 141.7 117.9 100.8 90.8 83.1 77.0 67.4 49.3 30.4 18.0 10.6 7.4 3.1 1.5 MAG 6.443 6.594 6.623 6.522 6.613 6.481 6.424 6.353 6.234 6.137 5.992 5.972 5.867 5.679 5.582 5.380 5.122 4.880 4.634 4.475 S21 ANG S12 MAG .001 .003 .004 .005 .008 .009 .010 .011 .014 .015 .016 .019 .019 .022 .021 .022 .024 .024 .025 .026 ANG 77.0 51.8 47.7 51.1 33.1 21.7 14.7 S22 MAG .403 .406 .418 .417 .424 .422 .426 .433 .442 .455 .455 .453 .433 .409 .375 .349 .318 .294 .268 .248 ANG K -19.4 -38.7 -58.1 -77.5 -96.9 -116.1 -135.1 -153.6 -172.1 169.6 151.1 133.3 115.1 97.0 79.1 61.8 44.5 27.9 11.7 -3.9 -7.8 -14.3 -16.7 -20.5 -4.4 -.4 -10.5 -24.2 -28.7 -48.0 -63.4 -72.2 -86.9 -99.6 -110.7 -122.9 -135.3 -146.0 -5.3 -8.6 -11.0 -14.0 -16.2 -19.4 -23.8 -27.7 -32.1 -34.7 -37.5 -39.7 -42.7 -45.5 -48.3 -49.9 -50.0 -49.2 -45.4 -40.5 108.63 20.56 16.33 12.34 8.14 7.22 6.52 5.63 4.80 4.44 4.02 3.49 3.40 3.16 3.38 3.36 3.42 3.67 3.73 3.91 15 mPC2745TB, mPC2746TB PACKAGE DIMENSIONS 6 pin super minimold (unit : mm) 0.2 +0.1 -0 0.1 to 0.15 +0.1 -0 1.25 0.1 2.1 0.1 0 to 0.1 0.65 1.3 0.65 0.7 0.9 0.1 2.0 0.2 16 mPC2745TB, mPC2746TB NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation). All the ground pins must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to VCC line. (4) The DC cut capacitor must be each attached to input and output pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered in the following recommended conditions. Other soldering methods and conditions than the recommended conditions are to be consulted with our sales representatives. mPC2745TB, mPC2746TB Soldering method Infrared ray reflow VPS Soldering conditions Package peak temperature : 235 C, Hour : within 30 s. (more than 210 C) Time : 3 times, Limited days : no.* Package peak temperature : 215 C, Hour : within 40 s. (more than 200 C) Time : 3 times, Limited days : no.* Soldering tub temperature : less than 260 C, Hour : within 10 s. Time : 1 times, Limited days : no.* Pin area temperature : 300 C, Hour : within 3 s/pin. Limited days : no.* Recommended condition symbol IR35-00-3 VP15-00-3 Wave soldering WS60-00-1 Pin part heating * It is the storage days after opening a dry pack, the storage conditions are 25 C, less than 65 % RH. Note 1. The combined use of soldering method is to be avoided (However, except the pin area heating method). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). 17 mPC2745TB, mPC2746TB [MEMO] 18 mPC2745TB, mPC2746TB [MEMO] 19 mPC2745TB, mPC2746TB ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96. 5 NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation. |
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